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science_technology_and_other_research_and_development · DOC-NIST

CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

National Institute of Standards and Technology · 2023-NIST-CHIPS-SMME-01

68 days left

Deadline

November 1, 2026

GRANTQUICK SUMMARYPlain-English Overview

CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment. National Institute of Standards and Technology. The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the... Funding amounts not specified.

Who Should Apply

Other eligible entities

Who Should NOT Apply

Individuals and organizations outside the specified eligible types

Key Requirements (Plain English)

  • An applicant must be a “covered entity” to receive CHIPS Incentives
  • Deadline: 2026-11-01

💡 GrantQuick Tip

Focus your proposal on clear outcomes, alignment with agency priorities, and demonstrate organizational capacity.

Competitiveness: Moderate to high — federal grants are always competitive

What This Grant Funds

The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.


For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.


Attachments

Who Can Apply

An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.

Eligible Applicant Types

Other (see NOFO for details)

Funding Details

Cost Sharing Required?
No
Funding Instrument
cooperative_agreement

Key Dates

Posted: September 29, 2023
Application Deadline: November 1, 2026 (68 days remaining)

Agency Contact

Misty Roosa Management Analyst

apply@chips.gov

Ready to apply?

View the full NOFO and submit your application on Grants.gov